Thermal Solutions for Electronics

This range of high adhesion thin tapes offers efficient thermal transfer for a wide range of applications requiring a thermal management solution: bonding heat sinks, heat spreaders and other cooling devices to IC packages, power transistors, and other heat generating components.

3M^™ combines high performance acrylic adhesive with highly conductive ceramic particles for an extremely reliable and user-friendly thermal interface. Highly conformable construction provides excellent wet-out on surfaces.

Available in  5, 10, 15 and 20 mil thicknesses to meet application requirements. The unique 40 mil 9889FR is a highly conformable pressure-sensitive film that offers a combination of high thermal conductivity, good dielectric properties, high bond strength, and ease of use. 

Increased wet-out improves both mechanical and thermal performance. Relative darker color indicates surface contact has occurred. Boron nitride filler appears lighter in color versus aluminum oxide filler.